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| Capacity |
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| PCB technical capacity parameter |
| Item |
Mass processing capability |
Small batch processing capability |
| Layer (Max.) |
2-22 |
24-28 |
| Type of the board material |
FR-4, high-TG , aluminum base, Rogers, etc., F4, BT |
PTFE,PPO,PPE , |
| Rogers,etc |
E-65,ect |
| Compound pressed board |
4 layers 6 layers |
6 layers 8 layers(FR-4+Rogers) |
| Maximum Size |
400mm X 700mm |
500mm X 1000mm |
| Outline Size Tolerance |
+/-0 .13mm |
+/-0.10mm |
| V-CUT Deepness Tolerance |
+/- 0.15 mm (V-CUT);+/- 0.1 mm (CNC V-CUT) |
| BoardThicknessRange |
0.1mm--6.0mm |
7.0--8.0mm |
Board Thickness Tolerance( t  0.8mm) |
+/-8% |
+/-5% |
Board Thickness Tolerance (t }YC.jpg) 0.8mm) |
+/-10% |
+/- 8% |
| Medium Thickness(Min) |
0.065mm(RCC) |
0.05mm |
| Minimum Line Width |
0.075mm(3mil) |
0.063mm(2.5mil) |
| Minimum Line Distance |
0.075mm(3mil) |
0.063mm(2.5mil) |
| Line Margin |
0.2 mm(CNC);0.30 mm (punch);0.50 mm (V-CUT) |
| Outer layer copper thickness |
9um--140um |
175um--210um |
| Inner layer copper thickness |
9um--140um |
175um--210um |
| Drill hole size (mechanical hole) |
0.25mm--6.00mm |
0.15mm--0.25mm |
| Finish Hole size (mechanical hole) |
0.10mm--6.00mm |
0.05mm--0.1mm |
| Hole size tolerance (mechanical hole) |
+/- 0.076 mm (normal hole) +/- 0.05 mm (fit-press hole) +0.1/-0.05 mm (punch hole) |
| Hole position deviation (mechanical hole) |
+/-0.075mm: (drill hole) : +/- 0.10 mm (punch hole) |
0.050mm |
| Laser hole size |
0.10mm (1+n+1;2+n+2) |
0.075mm |
| Aspect Ratio |
10:1 (drill hole size>0.2mm) |
12:1(drill hole size>0.25mm) |
| Solder mask type |
sensitive green, yellow, black, MATT, blue, red ink,and peelable blue glue. |
| Minimum width of solder mask bridge |
0.10mm |
0.075mm |
| Minimum size of solder mask separation ring |
0.05mm |
0.025mm |
| Soldermask oil plug hole diameter |
0.25mm--0.60mm |
0.6mm-0.70mm |
| Impedance tolerance |
+/- 10% (impedance>50ohm); +/- 5ohm(impedance<50ohm) |
+/- 5% (impedance>50ohm) |
| Surface processing type |
HAL, plating nickel gold(soft gold/flash gold), thick & hard gold, chemical nickel gold,immersion tin,lead-free H.A.S.L, Entek,gold-finger,and selective surface processing. |
PCBA technical capacity parameter
| Main production equipment |
Lin1 |
Semi-auto printer +JUKIKE2050M + MV2C-A + MPA-3 + Taiji soldering machine(11 ZONES) |
| Lin2 |
Semi-auto printer +JUKIKE2050M + MV2C-A + MPA-3 + Gelin soldering machine (5 ZONES) |
| Lin3 |
SPP-G1 + JUKIKE2060CM + YV100XE + MPA 3 + FLEXTRONICS REFLOWER (5 ZONES) |
| Lin4 |
DEK ELA +JUKIKE2060CM +YV100XE + MPA-3 + KELONG REFLOWER (8 ZONES) |
| Lin5 |
DEK ELA +YV100XE + YV100XE + 2060+ HELLER 1800W (8 ZONES) |
| Lin6 |
SPPD + TCM3500Z + HELLER 1800EXL(8 ZONES) |
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Line7 |
America PACEST350 BGA 2 sets of counter- repairing stations |
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LIne8 |
Bonding machines, ASM-AB599 ( 5 sets ) ASM-AB520(6 sets) ASM-510C(5sets) |
| SMT speed |
CHIP components SMT speed 0.3S/ pcs, max speed 0.16S/ pcs. |
| SMT |
Smallest SMT components size can reach to 0201, accuracy can reach to 0.1mm. can SMT PLCC ，QFP ， BGA ，CSP and so on，leg distance can reach 0.3mm.We have advanced technology in SMT supper-thin PCB, FPC gold finger and so on. Can SMT/DIP mixed SMT/DIP TFT, drive –engine, mobile main board, batteryprotection circuit and some other difficult products and components
Small order manufacturing from pcb manufacture --material purchasing --SMT/DIP processing --testing/ package--7days of delivery. |
| Daily production capacity |
7,000,000 points |
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